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转载 | Last Day to Get Early Bird Discount, Register NOW →

转载 | Last Day to Get Early Bird Discount, Register NOW → 上海立芯
2024-04-11
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导读:ISEDA 2024 May 10-13, 2024 | Xi'an, China



REGISTRATION GUIDELINE

Registration Rate

GROUP DISCOUNT


Register TEN at the same time to get TWO free. 

Only the lower 2 registration fee can be waived.

  • Reduced registration fees will be calculated based on the price of the lowest registration fee in the group.

  • For any other queries, please feel free to contact us!

Online Registration

Payment can be made by credit card, Alipay, WeChat or bank transfer. Scan the QR code to register NOW!

Registration Link: https://iconf.young.ac.cn/foKqg


HOTEL BOOKING

Shaanxi Hotel

No. 1 Zhangba North Road, Yanta District, Xi 'an, Shaanxi

Scan the QR code for hotel booking

Booking link:https://iconf.young.ac.cn/mQhXy


SCOPE

Sponsored by IEEE and ACM, and jointly organized by EDA² and the EDA Committee of CIE, the ISEDA (International Symposium of EDA) is an annual premier forum dedicated to VLSI design automation. The symposium aims at exploring the new challenges, presenting leading-edge technologies and providing EDA community with opportunities of predicting future directions in EDA research areas. ISEDA covers the full range of EDA topics from device and circuit levels up to system level, from analog to digital designs as well as manufacturing. The format of meeting intends to cultivate productive and novel interchangeable ideas among EDA researcher and developers. Academic and industrial EDA related professionals who are interested in EDA's theoretical and practical research are all welcomed to contribute to ISEDA.


COMMITTEE

向上滑动阅览

Executive Committee

General Chairs

Ru Huang

President of Southeast University

Academician of the Chinese Academy of Sciences

Yue Hao

Professor of Xidian University

Academician of the Chinese Academy of Sciences

Steering Committee

Shaojun Wei

Xuan Zeng

Patrick Girard

Technical Program Committee

Conference Chairs

Zhangming Zhu

Runsheng Wang

Jun Yang

Technical Program Chairs

Hailong You

Yun Liang

Hao Yan

Special Session Chair

Wenjian Yu

Industrial Session Chair

Fan Yang (GWX)

Tutorial/Training Chair

Zuochang Ye

Finance Chair

Gang Chen

Keynote Speaker Chair

Wanli Chang

Panel Chair

Yibo Lin

Local Arrangements Chair

Xiaoning He

Session Chair

Cheng Zhuo

Publication Chair

Qiang Xu

Industry Liaison

Yutao Ma

Exhibition Chair

Megy Wang

Publicity Chair

Xin Li

Outreach Chair – US

Hai Zhou

Outreach Chair – Canada

Peter Chun

Outreach Chair – Europe

Zebo Peng

Outreach Chair – Asia

Xiaoqing Wen

Track Committee

Technology & Model Chair: Xingsheng Wang

Technology & Model Co-Chair: Lining Zhang


Analog Circuit Chair: Fan Yang (FDU)

Analog Circuit Co-Chair: Hao Yu


Digital Design & Verification Chair: Zhufei Chu

Digital Design & Verification Co-Chair: Yong Fu


Physical Implementation Chair: Hailong Yao

Physical Implementation Co-Chair: Peng Cao


Wafer Manufacturing Chair: Lan Chen

Wafer Manufacturing Co-Chair: Yayi Wei


Packaging & Multi-Physics Chair: Hongliang Lu

Packaging & Multi-Physics Co-Chair: Min Tang 


Emerging Technology Chair: Bei Yu

Emerging Technology Co-Chair: Li Jiang


EDA Foundation & Standards Chair: Xiaohui Tan

EDA Foundation & Standards Co-Chair: Duanduan Jian


Open Source EDA Track Chair: Huawei Li

Open Source EDA Track Co-chair: Guojie Luo


EDA Contest Chair:  Longxing Shi

EDA Contest Chair Co-Chair: Zhixiong Di


AREAS OF INTEREST

Original papers in, but not limited to, the following areas are invited:

  • 1. Technology & Model

  • 2. Analog Circuit

  • 3. Digital Design & Verification

  • 4. Physical Implementation

  • 5. Wafer Manufacturing

  • 6. Packaging & Multi-Physics

  • 7. Emerging Technologies

  • 8. Miscellaneous

Important Dates

Notification of Acceptance:

March 25, 2024

Deadline for Final Version:

April 10, 2024

Deadline for Early Bird Registration:

April 10, 2024

Deadline for Invited Talks, Extended Abstracts, Tutorials, Special Sessions, Industry Sessions:

March 15, 2024

Liaison

IEEE/CEDA Representative: Tsung-Yi Ho

CIE Representative: Shouyi Yin

Website Chair: Huixin Tang

Secretary: Xiakai Wang


PREVIOUS TWEETS

▼ 向下滑动查看往期精彩内容

ISEDA 2023 Best Paper in Technology & Model Track

ISEDA 2023 Best Paper in Packaging & Multi-Physics Track

ISEDA 2023 Best Paper in Emerging Technologies Track

ISEDA 2023 Best Paper in Wafer Manufacturing Track

ISEDA 2023 Best Paper in Digital Design & Verification Track

ISEDA 2023 Best Paper in Analog Circuit EDA Track

Best Paper of ISEDA 2023 | iEDA: An OS Infrastructure of EDA

【ISEDA 2023 Ei & Scopus Indexed】ISEDA 2024 is calling for papers

【Call For Papers】ISEDA 2024投稿进行中,诚邀投稿!


CONTACT US


Scan the QR code above or copy the link to 

visit the conference homepage.

https://www.eda2.com/iseda/index.html

Conference Secretary | Joyce Zhong

Email | iseda@eda2.com

Tel | +86-186 2826 3876

Yu Huang | huangyu61@hisilicon.com



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上海立芯
上海立芯软件科技有限公司(LEDA Technology)专注物理设计和逻辑综合等集成电路电子设计自动化(EDA)工具开发,拥有国际一流的布局技术,助力搭建中国自主化芯片研发生态系统。
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上海立芯 上海立芯软件科技有限公司(LEDA Technology)专注物理设计和逻辑综合等集成电路电子设计自动化(EDA)工具开发,拥有国际一流的布局技术,助力搭建中国自主化芯片研发生态系统。
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