​展商风采 | 全球半导体覆铜陶瓷载板厂商——富乐华参展NEAS CHINA 2024上海展

富乐华总部（江苏富乐华半导体科技股份有限公司）坐落在江苏省东台市高新区，专业从事功率半导体覆铜陶瓷载板（AMB、DCB、DBA和DPC）业务，集研发、制造、销售于一体，为功率半导体厂商提供从材料、制造、封装、测试的一整套完整解决方案。旗下拥有上海富乐华半导体科技有限公司、江苏富乐华功率半导体研究院有限公司、上海富乐华国际贸易有限公司、四川富乐华半导体科技有限公司、马来西亚富乐华半导体科技有限公司、欧洲和日本销售子公司。

富乐华充分依托Ferrotec集团自1995年开始在覆铜陶瓷载板领域耕耘所取得的先进技术，不断升级软硬件设施、提升研发团队实力、提高流程管理效率，管理体系已通过 ISO9001, ISO14001, IATF16949,ISO27001, ISO45001, QC080000等多项认证，产品已通过UL安全认证，为客户提供代表行业先进水平的半导体功率模块用覆铜陶瓷载板产品，销售网络已覆盖全球近20个国家。

Ferrotec (FLH) headquarters (Jiangsu Ferrotec Semiconductor technology Co., LTD.) is located in High-tech zone, Dongtai, Jiangsu province of China, which is specialized in the business of copper bonded ceramic substrate (AMB, DCB,DBA and DPC) for power semiconductor, integrating R&D, manufacturing, sales, providing power semiconductor manufacturers a complete set of solution from materials, manufacture, assembly and test.

Its subsidiaries include Shanghai Ferrotec Power Semiconductor Co., LTD., Jiangsu Ferrotec Power Semiconductor R&D Institute Co., LTD., Shanghai Ferrotec International Trading Co.,LTD., Sichuan Ferrotec Power Semiconductor Technology Co.,Ltd. Ferrotec Power Semiconductor Malaysia SDN.BHD.and subsidiaries in Europe, Japan.

Fully relying on Ferrotec group's advanced technology in the field of copper bonded ceramic substrates since 1995, Ferrotec(FLH) has been constantly upgrading hardware and software facilities, enhancing the strength of R&D team and improving the efficiency of process management. The management system has passed several certifications, such as ISO9001, IS014001,IATF16949, ISO27001, ISO45001 QC080000 and the products have passed UL safety certification, to provide customers with copper bonded ceramic in advanced level in the industry used for semiconductor power module.THE sales network covers 20 regions around the world.