CONFERENCE OVERVIEW
The DesignCon Technical Conference Program consists of 14 tracks covering all aspects of electronic design, from chips through boards and systems.
Through more than 100 technical paper sessions, panels and tutorials, conference attendees gather the latest theories, methodologies, applications and advanced design tools related to signal and power integrity, jitter and crosstalk, test and measurement, parallel and memory interface design, ICs, semiconductor components and more.
| CONFERENCE HOURS |
|---|
| Tuesday, January 27: 9:00 AM – 6:00 PM |
| Wednesday, January 28: 8:30 AM – 5:00 PM |
| Thursday, January 29: 8:30 AM – 5:00 PM |
| Friday, January 30: 9:00 AM – 11:20 PM |
EVENT AT-A-GLANCE
DESIGNCON 2015 TRACKS
CONFERENCE OVERVIEW
The DesignCon Technical Conference Program consists of 14 tracks covering all aspects of electronic design, from chips through boards and systems.
Through more than 100 technical paper sessions, panels and tutorials, conference attendees gather the latest theories, methodologies, applications and advanced design tools related to signal and power integrity, jitter and crosstalk, test and measurement, parallel and memory interface design, ICs, semiconductor components and more.
| CONFERENCE HOURS |
|---|
| Tuesday, January 27: 9:00 AM – 6:00 PM |
| Wednesday, January 28: 8:30 AM – 5:00 PM |
| Thursday, January 29: 8:30 AM – 5:00 PM |
| Friday, January 30: 9:00 AM – 11:20 PM |
EVENT AT-A-GLANCE
DESIGNCON 2015 TRACKS
Optimize Chip-Level Designs for Signal and Power Integrity
Overcome Analog and Mixed-Signal Modeling and Simulation Challenges
Wireless and Photonic Integration
System Co-Design: Chip/Package/Board: Modeling and Simulation
Characterize PCB Materials and Processing Characterization
Apply PCB Design Tools
Design Parallel and Memory Interfaces
Optimize High-Speed Serial Design
Detect and Mitigate Jitter, Crosstalk, and Noise
Leverage High-Speed Signal Processing for Equalization and Coding
Ensure Power Integrity in Power Distribution Networks
Achieve Electromagnetic Compatibility and Mitigate Interference
Apply Test and Measurement Methodology
Ensure Signal Integrity with RF/Microwave/EM Analysis Techniques
DesignCon技术会议项目覆盖电子设计的14个主要方面,从芯片到基板和系统。
通过超过100篇技术论文会话、面板和教程,与会者收集最新的理论、方法、应用程序和先进的设计工具相关的信号和电源完整性、抖动和相声、测试和测量、并行和内存接口设计、集成电路、半导体组件等等。
1、优化芯片级设计信号和电源完整性。2、克服模拟和混合信号建模与仿真的挑战。3、无线和光子集成。4、系统设计：芯片/封装/基板：建模，仿真。5、PCB材料和加工特性。6、PCB板设计工具。7、并行设计和内存接口。8、高速串行优化设计。9、检测和减轻抖动、串扰和噪声。10、利用高速信号处理均衡和编码。11、确保电源完整性在电源匹配网络。12、实现电磁兼容和减轻干扰。13、应用测试和测量方法。14、确保信号的完整性与射频/微波/注：本文提及的商标及版权为其原所有人所有