IC China 2026丨从底座到落地场景，泓明数科呈现全链路实践

本届展会上，泓明数科重点呈现了玄水AI原生底座。其企业架构按“一条主干（SCOR DS Plus）、一个底座（唯一识别码+三账五流）、三条业务线、N个场景应用”设计。底座将行业规则、企业知识与监管要求转化为机器可识别、可推理的语义模型，使专家判断成为可执行、可审计的资产，支持一次建模、多场景复用。三条业务线同步呈现：贸易合规方向，商品归类、两用物项判定、CCC判定、单证审核以智能体矩阵形态输出秒级响应、全程留痕的判定结论；供应链管理方向，订单控制塔打通50+环节全链路可视；金融服务方向，三账五流数据资产让供应链信用可被验证、可被金融机构采信。

供应链数字孪生解决方案以3D+IoT全景可视，做到三个尺度四级穿透，实现单品级追溯与主动预判，而非等问题发生后再回溯。以大数据为核心驱动力，构建覆盖供应链全链路的物流追踪与监控体系。方案打通国内外运输追踪与仓库实时运营数据，实现从原材料发货到最终配送的端到端可视化管控，让每一颗物料的流转轨迹清晰可见，助力企业打造供应链物流一体化闭环。

全链路智能恒温避震运输方案针对精密设备运输中安全与成本难以兼顾的痛点，提供23℃±2℃无源温控与2.6G抗振能力，让精密设备与零部件按普货条件安全运输，无需为每一票单独申请特殊运输资源。

全球头部半导体企业正大规模部署数字孪生，依托实时数据采集、1:1虚拟映射与AI/ML分析引擎，打通MES/EAP/APC/SPC等系统数据，形成“数据感知—实时分析—智能决策—精准执行”闭环，覆盖工艺开发、预测性维护、虚拟调试与产线仿真全场景，目前正从设备级监控升级为工厂级智能决策。

将某国际半导体设备龙头上海周边供应商的分散货源集中至上海Hub，通过预报协同、装载与路径优化、排程提货和集中拼箱，替代各供应商独立跨境发货，统一发往新加坡、美国等主要市场，年度为客户节约综合物流成本约1,600万美元。

某国际头部芯片企业国内售后中心落地浦东机场综保区，通过空侧直通、先入区后报关，衔接售后件入区与中心业务处理，目前正升级为该企业的亚太检测更换中心。

IC China 2026展期持续至11月14日，泓明数科在4T-096展位现场进行产品演示与讲解。欢迎广大客户与新老朋友莅临展位，围绕AI原生供应链解法展开交流。

HMG Smart DiTech highlighted the Xuanshui AI-native foundation, designed around "one backbone (SCOR DS Plus), one foundation (Unique Identifier + Three Accounts and Five Flows), three business lines, and N scenario applications." 

The Supply Chain Digital Twin Solution provides 3D+IoT panoramic visualization with three scales and four-level penetration for item-level traceability and proactive prediction. 

The Full-Link Intelligent Constant-Temperature Shock-Absorbing Transportation Solution addresses the balance between safety and cost for precision equipment. 

Leading semiconductor companies are deploying digital twins through real-time data collection and 1:1 virtual mapping. By integrating MES, EAP, APC, and SPC systems, it forms a closed loop of "sensing, analysis, decision-making, and execution," covering process development, predictive maintenance, and virtual commissioning—upgrading from equipment-level monitoring to factory-level intelligent decision-making.

Scattered cargo from local suppliers of a leading international semiconductor equipment company is consolidated at the Shanghai Hub. Through advance reporting, route optimization, and centralized consolidation, it replaces independent cross-border shipments to markets like Singapore and the U.S., saving the customer roughly USD 16 million in annual logistics costs.

The domestic after-sales center of a leading international chip enterprise in the Pudong Airport Comprehensive Bonded Zone utilizes airside direct connection and "entering the zone before customs declaration" to streamline after-sales processing. 

IC China 2026 runs until November 14. HMG Smart DiTech is conducting live demonstrations at Booth 4T-096. We welcome all customers and friends to visit and exchange views on AI-native supply chain solutions.