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11月10日，第九届中国国际进口博览会在国家会展中心（上海）闭幕。展会期间，泓明数科在技术装备展区3C1-08展位展示玄水AI原生底座及场景智能体产品矩阵，围绕半导体供应链智能化升级与产业链上下游伙伴进行交流。
本届进博会上，泓明数科重点呈现玄水AI原生底座的设计逻辑：一条主干（SCOR DS Plus）、一个底座（唯一识别码+三账五流）、三条业务线、N个场景应用。底座将行业规则、企业知识与监管要求转化为机器可识别、可推理的语义模型，使专家判断成为可执行、可审计的资产，并支持一次建模、多场景复用。
三条业务线在展位集中展示：贸易合规方向，商品归类、两用物项判定、CCC判定、单证审核以智能体矩阵形态呈现，强调秒级响应、全程留痕；供应链管理方向，订单控制塔打通50+环节全链路可视，数字孪生将断供风险从“事后补救”前移至“事前预判”；金融服务方向，三账五流数据资产让供应链信用可被验证、可被金融机构采信。智慧供应链数字孪生与综保区售后中心等案例也在展位进行了落地细节交流。
11月6日，泓明供应链集团董事长沈翊在上海会议圆桌环节进行分享，为展位呈现的技术路径补充产业逻辑。
沈翊提出，客户最认可的往往是难以量化的信任，而信任的底座是合规能力：问题能否补救、监管问询能否讲清、交付承诺能否写入合同。泓明七年投入围绕三件事展开：把经验变成机器能读懂的语言，让机器结论可追溯、可担责，把能力变成合同里的承诺。
沈翊同时提到，标准是竞争力的上游。产品会被追上，但标准不会。谁先定义产业语义规则，后来者就需按这套规则执行。这也是玄水底座优先做语义层的原因——它不仅是产品选择，也是基础设施层面的布局。
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感谢每一位莅临3C1-08展位、参与交流的行业伙伴。进博会收官，泓明数科将继续深耕产业、协同伙伴，为提升半导体供应链韧性与确定性、推动数智化升级持续贡献力量。
On November 10, the 9th China International Import Expo (CIIE) closed at the National Exhibition and Convention Center (Shanghai). During the expo, HMG Smart DiTech showcased its Xuanshui AI-native foundation and scenario-based intelligent agent product matrix at Booth 3C1-08 in the Technical Equipment Exhibition Area.
Booth Display: Xuanshui Foundation and Three Business Lines
At this year's CIIE, HMG Smart DiTech highlighted the design logic of the Xuanshui AI-native foundation: one backbone (SCOR DS Plus), one foundation (Unique Identifier + Three Accounts and Five Flows), three business lines, and N scenario applications.
Shanghai Meeting: From Compliance Foundation to Standards Upstream
On November 6, Sysy, Chairman of HMG Supply Chain Group, shared his views during a roundtable session at the Shanghai Meeting, adding industry logic to the technology pathway presented at the booth.
Sysy also mentioned that standards are upstream of competitiveness. Products can be caught up with, but standards cannot. Whoever defines industry semantic rules first will require later entrants to follow those rules. This is also why the Xuanshui foundation prioritized the semantic layer—it is not only a product choice but also an infrastructure-level positioning.
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Outlook: Deepening Industry Engagement and Collaborating with Partners
As the CIIE concludes, HMG Smart DiTech will continue to deepen its industry engagement and collaborate with partners, contributing to enhancing the resilience and certainty of the semiconductor supply chain and advancing digital-intelligent upgrading.
编辑 | 泓明数字营销部
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