KAISI 无铅环保焊锡膏 三温可选
低温 138℃｜中温 183℃｜高温 220℃
BGA 植锡、主板维修，上锡饱满，减少虚焊！
KAISI Lead-Free Eco-friendly Solder Paste | 3 Temperature Grades Available Low Temperature: 138℃｜Medium Temperature: 183℃｜High Temperature: 220℃ Ideal for BGA reballing and motherboard repair, featuring good wetting for full solder deposits and fewer cold solder joints.
🔹无铅低温锡膏｜熔点 138℃ 低熔点无铅锡浆，降低加热风险，保护不耐高温芯片，性价比优选，适合敏感元件植锡焊接
🔹含银中温锡膏｜熔点 183℃ 含银配方，导电性能优异，焊点饱满光亮，连锡少，焊接强度高，日常维修主力款
🔹无铅高温锡膏｜熔点 220℃ 植锡不易起泡，锡珠均匀，焊点牢固稳定，耐高温工况，适合长期稳定工况
✅规格：20g / 40g 两种瓶装
✅适用：手机维修、BGA 植锡、SMT 贴片、PCB 电阻电容 IC 焊接
KAISI Solder Paste, 3 types for your repair work ▫️Lead-free Low Temp: 138℃ Low melting point, protect heat-sensitive components, eco-friendly lead-free paste ▫️Silver-containing Medium Temp:183℃ Good conductivity, bright & full solder joints, less bridging ▫️Lead-free High Temp:220℃ No bubble during stencil reballing, uniform tin ball, strong soldering Net weight: 20g / 40g Application: BGA reballing, SMT, PCB IC, resistor & capacitor soldering
膏体细腻顺滑 免清洗配方，减少后续工序 粘力出众，粘度变化小 印刷后长时间不易塌边、不塌陷 贴装元件稳固，不易偏移移位 提升植锡与 SMT 印刷良率，维修生产更高效！
Fine smooth paste, no-clean formula. Superior adhesion & stable viscosity. Anti-sagging after printing, components stay in position. Higher yield for SMT printing & BGA reballing, efficient for repair and production.
焊点光亮饱满｜导电性好 焊点圆润光亮，爬锡能力强 杜绝虚焊、假焊，耐氧化，不腐蚀 PCB 板
Bright and full solder joints with great conductivity. Round and shiny solder joints, excellent tin wetting. Prevent cold and false soldering, anti-oxidation, non-corrosive to PCB boards.
