说明：
1. 基本的通信方式都携带了，BLE4.1，WIFI，Sub-GHz和NFC，还有超多的传感器供使用测试。
2. 云端方面是用的亚马逊的AWS，而且ST还专门做了一个STM32Cube的扩展软件包X-CUBE-AWS，所有需要的驱动都做好了，以帮助快速连接亚马逊AWS。
3. 官方地址：http://www.st.com/content/st_com/en/about/media-center/press-item.html/n3946.html
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板子规格：
• Ultra-low-power STM32L4 Series MCUs based on ARM® Cortex®-M4 core with 1 Mbyte of Flash memory and 128 Kbytes of SRAM, in LQFP100 package
• 64-Mbit Quad-SPI (Macronix) Flash memory • Bluetooth® V4.1 module (SPBTLE-RF)
• Sub-GHz (868 or 915 MHz) low-power-programmable RF module (SPSGRF-868 or SPSGRF-915)
• Wi-Fi® module Inventek ISM43362-M3G-L44 (802.11 b/g/n compliant)
• Dynamic NFC tag based on M24SR with its printed NFC antenna
• 2 digital omnidirectional microphones (MP34DT01)
• Capacitive digital sensor for relative humidity and temperature (HTS221)
• High-performance 3-axis magnetometer (LIS3MDL) • 3D accelerometer and 3D gyroscope (LSM6DSL)
• 260-1260 hPa absolute digital output barometer (LPS22HB)
• Time-of-Flight and gesture-detection sensor (VL53L0X) • 2 push-buttons (user and reset)
• USB OTG FS with Micro-AB connector
• Expansion connectors: – Arduino™ Uno V3 – PMOD
• Flexible power-supply options: – ST LINK USB VBUS or external sources
• On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, virtual COM port and debug port
• Comprehensive free software HAL library including a variety of examples, as part of the STM32Cube package
• Support of a wide choice of Integrated Development Environments (IDEs) including IAR™, Keil®, GCC-based IDEs, ARM® mbed Enabled™
• ARM® mbed Enabled™(see http://mbed.org)
软件框架：
板子效果：
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