GLOBAL PCB DAILY
全球PCB行业每日动态
2026年10月19日（周一）
南京的芯爱科技A2轮近15亿收官，平安电工掏4.36亿去泰国建电子布厂，中京电子7亿定增落地，钱分头去了泰国基地和惠州技改；海外也一样，Amkor在光州把先进封装的投资从1万亿韩元加码到3万亿，10月19日已经动土。另一头，材料端的紧还没解——联茂董事长在泰国新厂讲了句大白话，最大的机会是订单做不完，最大的挑战是原料拿不到。设备化学品这边，MKS把Atotech和ESI捆成一条线摆上TPCA展台，说白了就是在赌谁能把更细的线路稳定做出来。
今日焦点 国内·资本/融资 10月19日14:00
芯爱科技完成A2轮近15亿元融资，胜宏、瑞芯微进场
南京的IC封装基板厂商芯爱科技，A2轮近15亿元融资落地。这轮由华兴资本担任独家财务顾问，进场的有胜宏科技、瑞芯微等产业战略投资方，江苏省市两级国资平台，以及一批财务投资机构；老股东武岳峰科创、厦门联和资本、越秀产业基金、和利资本、泰达科投等继续追加。到这轮为止，公司累计融资已经超过50亿元。
钱主要花在三个地方：高阶FCBGA封装基板产能扩充、玻璃基板研发、核心材料国产替代共研。公司说相关产品已通过国内头部AI芯片企业验证，这轮扩产是建立在客户验证基础上的，跟着客户产品陆续进入量产走。
芯爱2021年5月成立，总部在南京浦口经开区，做的是AI手机基板、AI/CPU/GPU基板、Coreless ETS、FCCSP、FCBGA这些。创始人张垂弘是联发科创始员工、前高级副总裁，也是手机主流基板Coreless ETS技术的主要发明人。
出处：芯东西（华兴资本披露），2026年10月19日14:00
EN | Nanjing-based IC package substrate maker CoreTech (Xin'ai) Technology has closed an A2 round of nearly RMB 1.5 billion, disclosed by China Renaissance on Oct 19. Strategic investors include Victory Giant and Rockchip, plus Jiangsu provincial and municipal state platforms; existing backers such as Wuyuefeng, Xiamen Lianhe and Yuexiu Industrial Fund added more. Cumulative funding now exceeds RMB 5 billion. Proceeds go to high-end FCBGA capacity, glass-substrate R&D and joint development of domestic material substitution. The company says its products have been validated by leading domestic AI chip customers, and this expansion rides on those qualifications as customer products enter volume production. Founded in May 2021 and headquartered in Nanjing Pukou, it covers AI phone substrates, AI/CPU/GPU substrates, Coreless ETS, FCCSP and FCBGA. Founder Zhang Chuihong is a founding MediaTek employee and former SVP, and the principal inventor of Coreless ETS.
2 国外·扩产/投资 10月19日
Amkor光州砸3万亿韩元扩先进封装，10月19日动土
美国封测大厂Amkor Technology在韩国光州厂区的扩建工程，10月19日举行奠基仪式，韩国产业通商资源部、光州影湾府、Amkor总部高管和全球客户代表到场。
投资额是3万亿韩元，执行期从2026年到2031年，比最初公布的1万亿韩元整整多了2万亿；新增就业约2000个，比6月那版计划多出约1000个。新厂做的是AI和HPC用先进封装产品，目标是2027年下半年先完工两栋、2028年上半年再完工两栋，之后进入量产。
对PCB这条线的意义在于，先进封装产能一旦铺开，FC-BGA这类高阶载板的需求跟着被拉起来，而载板恰恰是眼下最紧的一环。
出处：Aju Press（韩国产业通商资源部发布），2026年10月19日
EN | Amkor Technology held a groundbreaking ceremony on Oct 19 for the expansion of its Gwangju, Korea campus, attended by Korea's Ministry of Trade, Industry and Energy, the Gwangju mayor, Amkor HQ executives and global client representatives. The investment totals KRW 3 trillion for 2026–2031 — a full KRW 2 trillion more than the original KRW 1 trillion plan — and adds roughly 2,000 jobs, about 1,000 more than the June announcement. The new facility will produce advanced packaging for AI and HPC, with two buildings due by H2 2027 and two more by H1 2028, followed by mass production. For the PCB chain, the significance is that advanced-packaging capacity pulls demand for high-end substrates such as FC-BGA — currently one of the tightest links in the supply chain.
3 国内·扩产/投资 10月19日
平安电工投4.36亿元去泰国建电子布基地，做超薄布和石英布
做云母绝缘材料起家的平安电工，准备砸约4.36亿元，在泰国北柳府建一个面向高端电子制造的电子布生产基地。实施主体是全资子公司平安泰国，2026年10月计划向这个项目投入募集资金42537.32万元，建设期24个月，方案已经过了董事会，平安泰国也签了购地协议。
产品方向是超薄布和石英布。平安电工2011年通过同力玻纤补齐了无碱玻璃纤维布这条材料线，2019年开始特种电子布对外规模销售，2023年又启动石英纱、石英布研发，现在是工业布、电子布、石英布三条线并行。
逻辑不复杂：算力设备升级在改材料要求，PCB厂往东南亚搬又在改采购距离，电子布作为覆铜板的增强材料，布的厚度、热稳定性和介电性能都会影响下游选材，跟着客户走是必然的。
出处：至顶网，2026年10月19日
EN | Ping An Electric, which started in mica insulation materials, plans to invest about RMB 436 million in an electronic fabric base in Chachoengsao, Thailand. The vehicle is its wholly owned subsidiary Ping An Thailand, which will receive RMB 425.37 million of raised funds in October 2026 over a 24-month build; the plan has passed the board and the land agreement is signed. The products are ultra-thin fabric and quartz fabric. The company added alkali-free glass fiber cloth through Tongli Fiberglass in 2011, began scaled external sales of specialty electronic fabric in 2019, and started quartz yarn and quartz fabric R&D in 2023. The logic is straightforward: compute upgrades are changing material requirements, while PCB makers relocating to Southeast Asia are changing procurement distance — and fabric thickness, thermal stability and dielectric behavior all shape downstream material selection.
4 国内·扩产/投资 10月19日
中京电子7亿定增落地，钱投向泰国基地和惠州技改
中京电子10月19日披露了向特定对象发行A股的上市公告书：以14.89元/股发行4701.1417万股，募资总额7.00亿元，扣除发行费用后净额6.87亿元，新增股份10月21日在深交所上市。实控人杨林认购7000万元并锁定18个月，诺德基金、财通基金、UBS、J.P.Morgan、国泰海通、广发证券等机构也在获配名单里。
募资投向两块主业。一是出海：泰国大城府洛加纳工业区基地，年产55万平方米高多层刚性板，主体结构已完工并进入试生产。二是高端化：惠州技改项目设计产能28.75万平方米，用智能化设备换掉老旧产线，配合已经量产的9—11阶HDI能力，切AI服务器和汽车电子。
公司说2026年以来刚性板在手订单同比增长超过60%，产能利用率超过100%——订单跑在产能前面，这是这轮扩产最直接的动因。
出处：同花顺财经，2026年10月19日
EN | Zhongjing Electronic disclosed on Oct 19 the listing prospectus for its private A-share placement: 47,011,417 shares at RMB 14.89, raising RMB 700 million gross and RMB 687 million net, with new shares listing on the SZSE on Oct 21. Actual controller Yang Lin subscribed RMB 70 million with an 18-month lock-up; Nord Fund, Caitong Fund, UBS, J.P. Morgan, Guotai Haitong and GF Securities are also among the allottees. The money goes to two priorities: overseas expansion at its Ayutthaya (Rojana) Thailand base with 550,000 m²/yr of high-layer-count rigid boards — main structures done and in trial production — and high-end upgrades at Huizhou, where a 287,500 m² line replaces old equipment with intelligent lines, paired with already-volumed 9–11-step HDI capability, targeting AI servers and automotive electronics. The company says rigid-board orders on hand are up over 60% YoY in 2026 with utilization above 100% — orders running ahead of capacity is the most direct driver of this round.
5 国外·供需/材料 10月18日
联茂董事长一句"订单做不完"，把CCL现状说透了
铜箔基板厂联茂电子董事长陈进财在泰国巴真府新厂现场讲了两句话：最大的机会是订单做不完，最大的挑战是原料拿不到。他还说现在谈AI泡沫太早，三年内供需关系要改变"可能相当难"。
产业位置也有数据支撑。Prismark 2026年6月的报告显示，2025年全球特殊基板（含高速基板、封装基板、射频基板）市场总面积1.95亿平方米，联茂以15.5%的市占排在全球第二，仅次于台光电的20.3%。
营收结构已经翻过来了：到2026年上半年，AI服务器和网通设备这类"基础建设"应用占营收68%，车用16%，HDI与半导体相关5%，消费电子和工业降到11%。技术端，高阶胶片已通过美系AI GPU大厂和多家PCB厂认证，M9等级超低损耗材料陆续送样，还在CPO和低轨卫星方向提前布点。
产能上，泰国厂一期目前月产30万张，2026年底到60万张；二期规划2028年底再加60万张，届时泰国总月产能120万张。集团整体月产能从2026年570万张，往2027年630万、2028年825万、2029年915万张走。
出处：工商时报（引《财讯》双周刊泰国专访），2026年10月18日见报；陈进财同题采访的电视版10月13日已由非凡新闻播出
EN | ITEQ chairman Chen Jin-tsai, speaking at the company's new Prachinburi plant in Thailand, summed it up in two lines: the biggest opportunity is that orders can't all be filled, the biggest challenge is that raw materials can't be secured. He added that talk of an AI bubble is premature and that changing the supply-demand balance within three years would be "quite difficult." Prismark's June 2026 report puts 2025 global specialty substrate area at 195 million m², with ITEQ second worldwide at 15.5%, behind Elite Material's 20.3%. The revenue mix has flipped: by H1 2026, infrastructure applications — AI servers and networking — were 68% of revenue, automotive 16%, HDI and semiconductor-related 5%, with consumer and industrial down to 11%. High-end prepreg has been qualified by a US AI GPU major and multiple PCB makers; M9-grade ultra-low-loss material is sampling, with CPO and LEO-satellite work staged ahead. Thailand phase-1 runs 300,000 sheets/month now and reaches 600,000 by end-2026; phase-2 adds another 600,000 by end-2028 for 1.2 million total. Group monthly capacity goes from 5.7M sheets in 2026 to 6.3M in 2027, 8.25M in 2028 and 9.15M in 2029.
6 国内·技术/产品 10月19日
1.6T交换机批量出货，448G已经启动预研
沪电股份这轮的产品进度有个比较清晰的刻度：1.6T交换机已经批量出货，Rubin平台PCB在放量，英伟达、谷歌等头部客户从Q3开始密集拉货；泰国基地扭亏为盈，青淞三厂和黄石扩产项目的产能Q4加速释放。
更往前的技术档位上，224Gbps SerDes接口的PCB已经进入小批量供货，448Gbps方案正式启动预研。单通道速率翻倍再翻倍，信号完整性的控制难度是指数级上升的，沪电在昆山研发中心建了一条支持448Gbps级高频测试的信号完整性实验室。主力产品这边，28层以上HDI加埋容埋阻混合结构已经稳定量产。
出处：中财网，2026年10月19日；机构调研记录（10月19日披露）
EN | Wus Printed Circuit's product cadence is now fairly legible: 1.6T switches are in volume shipment, Rubin-platform PCB is ramping, and major customers including Nvidia and Google began pulling volume from Q3; the Thailand base has turned profitable, with capacity from the Qingsong plant-3 and Huangshi expansion releasing faster in Q4. Further up the technology curve, PCBs for 224Gbps SerDes interfaces have entered small-batch supply and the 448Gbps program has formally started pre-research. Doubling per-lane rate repeatedly raises signal-integrity difficulty exponentially, and Wus has built a signal-integrity lab in its Kunshan R&D center supporting 448Gbps-class high-frequency testing. Its mainstream products already stably mass-produce 28+ layer HDI with embedded capacitance and resistance.
7 国外·产品/技术 10月18日
MKS把Atotech和ESI打包，在TPCA展一站式先进PCB制造方案
MKS Instruments宣布，旗下做制程化学品、设备、软件和服务的Atotech，加上做激光系统的ESI，会在10月20—22日台北南港展览馆的TPCA Show 2026上，拿出一套面向PCB和封装基板的整合制造方案。
重点不是"能不能做出来"，而是"能不能大批量稳定做出来"。AI和HPC把互连密度、带宽、供电要求顶上去之后，板厂要交的是更高层数、更细线路、更薄介质、更紧组装公差的板子，表面状态、种子层和铜沉积质量、终处化稳定性直接决定良率。MKS这套把激光钻孔、电镀、表面改变化学品和设备串成一条线，覆盖前处理、成孔、电镀到终处化。
技术细节上，Atotech今年在亚洲技术中心加码投入，支持线宽线距≤5/5µm的高端SAP应用；结合层有BondFilm HF、BondFilm EX、NovaBond PX-S2，靠压住铜面粗糙度和线宽失真来降低导体损耗；Printoganth MV TP3系列做超薄化学铜沉积，配合G-Plate平台做量产级的微粒控制。
出处：DIGITIMES，2026年10月18日
EN | MKS Instruments announced on Oct 18 that Atotech (process chemicals, equipment, software and services) and ESI (laser systems) will present integrated manufacturing solutions for PCBs and package substrates at TPCA Show 2026, Taipei Nangang, Oct 20–22. The point is not whether a structure can be built but whether it can be built consistently at volume: as AI and HPC push interconnect density, bandwidth and power delivery, shops must ship higher layer counts, finer features, thinner dielectrics and tighter assembly margins — where surface condition, seed layer and copper deposit quality, and final-finish stability directly set yield. MKS links laser drilling, plating and surface-modification chemistries with equipment into one line covering pre-treatment, via formation, plating and finishing. Atotech is investing in its Asia technology centers to support high-end SAP at ≤5/5 µm line/space; its bonding portfolio — BondFilm HF, BondFilm EX, NovaBond PX-S2 — limits copper roughness and line-width distortion to cut conductor loss; the Printoganth MV TP3 family handles ultra-thin electroless copper, paired with the G-Plate platform for production-scale particle control.
8 国内·资本/人才 10月18日晚
生益科技董事长提议回购2—3亿元，用于员工持股或股权激励
10月18日晚，生益科技公告，董事长陈仁喜提议用自有或自筹资金回购部分A股，回购资金总额在2亿至3亿元之间，回购价格上限为董事会审议前30个交易日公司股票交易均价的150%，期限12个月，回购股份用于员工持股计划或股权激励。
覆铜板这轮景气里，材料配方、客户认证、批量一致性都靠人，公司把回购的股份拿去做员工持股和激励，指向的是把核心团队留住。
出处：生益科技公告（中国证券网、中财网10月19日报道）
EN | On the evening of Oct 18, Shengyi Technology announced that chairman Chen Renxi proposed repurchasing A-shares with own or self-raised funds totalling RMB 200–300 million, at a price no higher than 150% of the 30-trading-day average before board review, over a 12-month window, with the shares earmarked for an employee stock ownership plan or equity incentives. In a CCL upcycle where formulations, customer qualification and batch consistency all depend on people, using repurchased shares for employee ownership and incentives is about retaining the core team.
9 国内·人才/产学研 10月17日
臻鼎把"绿色AI-PCB共构研究室"摆进了中原大学
中原大学71周年校庆那天，学校宣布"十大共构实验室"正式启动，名单第一个就是"臻鼎｜中原绿色AI-PCB共构研究室"。臻鼎科技总经理简祯富作为产业代表上台，和建霖集团董事长陈岱桦、德微科技董事长张恩杰一起讲的都是同一套思路：把企业技术和设备搬进校园，共建能上手的学习场域。
这十个实验室里跟电子制造沾边的还有德微/亚昕先进功率半导体共构教育基地、积体电路设计共构实验室。校方同时披露，114学年度恰逢建校70周年，现金加实物捐赠总额到新台币1.79亿余元，是历年最高。
PCB这行缺人不缺数量，缺的是能直接上高阶制程的人。企业把设备和真课题送进学校，本质是把培养周期往前挪——这事单靠学校做不出来，单靠企业又太慢。
出处：PChome新闻、Yahoo奇摩新闻（中原大学71周年校庆发布），2026年10月17日
EN | Chung Yuan Christian University launched ten jointly-built laboratories at its 71st-anniversary ceremony on Oct 17, with the "Zhen Ding | Chung Yuan Green AI-PCB Joint Research Lab" first on the list. Zhen Ding Technology general manager Jian Zhen-fu spoke as an industry representative alongside Chien Lin Group chairman Chen Dai-hua and Dewei Technology chairman Zhang En-jie, all arguing the same case: move corporate technology and equipment onto campus and build hands-on learning environments. Two others touch electronics manufacturing — a Dewei/Asian advanced power-semiconductor education base and an IC design lab. The university also disclosed that donations, cash plus in-kind, in the 2025 academic year — its 70th — exceeded NT$179 million, a record. The PCB industry's talent gap is not about headcount but about people who can run advanced processes directly; putting equipment and real projects into a university pulls training forward — something schools cannot do alone and companies cannot do fast enough.
10 国外·并购 10月18日
印度Amber把Ascent Circuits买成全资子公司
印度Amber Enterprises公告，其重要子公司IL JIN Electronics（India）10月18日签署协议，收购Ascent Circuits剩余的1.50%股权——23401股，卖方为Manju Thomas。对价不走现金，IL JIN以每股10000卢比发行13120股强制可转换优先股（CCPS A2）做股份置换，交易预计10个工作日内完成。
交易完成后，Ascent Circuits成为IL JIN的全资子公司。这家公司是航空航天、国防、医疗、汽车领域的PCB供应商，营收三年连着往上走：FY24为26.32亿卢比，FY25为32.52亿卢比，FY26到了40.19亿卢比。
出处：Whalesbook（Amber Enterprises公告），2026年10月18日
EN | India's Amber Enterprises disclosed that its material subsidiary IL JIN Electronics (India) signed an agreement on Oct 18 to acquire the residual 1.50% stake — 23,401 shares — in Ascent Circuits from Manju Thomas. Consideration is non-cash: IL JIN will issue 13,120 compulsorily convertible preference shares (CCPS A2) at Rs 10,000 each, with closing expected within 10 business days. On completion, Ascent Circuits becomes a wholly owned subsidiary. It supplies PCBs into aerospace, defense, medical and automotive, with revenue rising three straight years: Rs 2.632 billion in FY24, Rs 3.252 billion in FY25 and Rs 4.019 billion in FY26. Full ownership gives Amber more direct control over its PCB asset without minority-shareholder process.
11 国外·技术/工具 10月18日
Konnect给KiCad 10塞了个AI插件，228个工具接进设计流程
Konnect发布了一个面向KiCad 10的原生插件，目前是beta状态，通过Model Context Protocol把Claude这类大模型直接接进PCB设计流程。它是单一Rust二进制，挂了228个工具、21个按需工具集，覆盖原理图捕获、PCB布局与布线、ERC/DRC检查、设计评审、JLCPCB器件搜索，一直到制造文件导出。
工程上主要解决了前代KiCAD-MCP-Server的三个毛病：调用链太长（原来一次工具调用要穿过TypeScript、schema校验、Python子进程、JSON管道、SWIG生成的C++代理对象），依赖面太大（要同时扛Node和Python两套生态），以及SWIG本身正在被KiCad弃用。Konnect改成走KiCad官方IPC API（protobuf over NNG），一次工具调用就是一次函数调用，发布为20—25MB的静态二进制、下载约9MB。对大模型来说还有个实际收益：工具全量暴露每次要点掉约23K token的上下文，改成路由按需加载后降到约2K。
出处：Hacker News（Konnect官方仓库），2026年10月18日
EN | Konnect has shipped a native KiCad 10 plugin, currently in beta, wiring Claude-class LLMs into the PCB design flow via the Model Context Protocol. It is a single Rust binary exposing 228 tools across 21 on-demand toolsets, covering schematic capture, layout and routing, ERC/DRC, design-review audits, JLCPCB part search and a full manufacturing export pipeline. It fixes three problems with its predecessor KiCAD-MCP-Server: an over-long call path (a single call previously crossed TypeScript, schema validation, a Python subprocess, JSON pipes and SWIG-generated C++ proxies), a huge dependency surface (Node and Python ecosystems plus bindings), and SWIG itself, which KiCad is deprecating. Konnect talks to KiCad 10 over the official IPC API (protobuf over NNG), so a tool call is a function call, shipped as a 20–25 MB static binary with a ~9 MB download. For LLMs there is a practical gain too: exposing all 228 tools costs roughly 23K tokens of context per listing, cut to about 2K by router-based on-demand loading.
GLOBAL PCB DAILY · 2026-10-19
信息均来自公开渠道 · 不构成投资建议
