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10月12日至16日，2026中国国际工业博览会·集成电路展（国芯展）在国家会展中心（上海）举行。泓明集团携AI原生供应链多项创新成果亮相，从人民日报专题报道到论坛演讲，从产品发布到生态伙伴奖，多维展现以数据与语义为根本重塑集成电路供应链底座的实践。
国芯璀璨：荣获生态合作伙伴奖
10月12日晚，“国芯璀璨·上海之夜”晚宴在上海洲际酒店大宴会厅举行，泓明集团荣获“生态合作伙伴奖”。这一奖项由行业协会颁发，旨在表彰在集成电路产业链上下游协同创新中作出突出贡献的生态合作伙伴。泓明与来自晶圆制造、封装测试、设备材料等领域的产业伙伴共同见证了这一时刻，标志着集团在构建集成电路产业供应链生态方面持续获得行业认可。
论坛演讲：从“AI加持”到“AI原生”
10月13日下午，2026集成电路设备材料零部件上下游协同创新发展论坛在国家会展中心5.2H-分论坛B区举行。泓明集团数智化解决方案总监洪世畅发表题为《AI时代半导体供应链的挑战与应对》的演讲，围绕供应链变局、AI带来的机遇和挑战， 落地场景三大场景展开。
变局之下，韧性上升为战略议题。 集成电路供应链正面临地缘与管制升级、需求结构剧变、合规强度提升、时效与成本双压四重压力叠加。出口管制清单动态调整，一次通关延误即牵动产线排程与客户承诺。供应链韧性已从成本议题上升为战略议题——数据底座的厚度决定韧性的下限，AI的赋能决定韧性的上限。
从“AI智能体应用”到“AI底座和体系建设”，关键分水岭在标准建立，数据治理+语义转化是核心。 没有标准，没有语义规范，智能体只是流程之外的外挂工具。洪世畅强调：无系统化、工程化控制的 AI 使用不是提效，是埋雷。泓明采用“先建标准，再用语义层倒推数据层治理”：先定义“什么是订单、订单有哪些状态”，再要求底层各系统数据全部对齐这个语义标准。没有语义层的“AI原生”只是口号；有了语义层，大模型才真正长在业务上。
10月13日，人民日报客户端上海频道以《工博会上，AI原生供应链发力》为题，报道泓明集团在国芯展上的多项产业创新成果。
报道指出，贸易合规智能体、供应链数字孪生仓库、全链路数智恒温避震运输方案、《集成电路制造与封测设备零部件归类指南》2.0集中亮相。泓明正式提出完成数智化供应链“第一跃”之后，向着AI原生供应链发起“第二跃”。
国芯展将持续至10月16日。泓明展位（5.2H-B021）持续开放，现场团队围绕玄水智能体底座（贸易合规智能体，归类智能体等）、供应链数字孪生仓库、全链路智能恒温避震运输方案、《集成电路制造与封测设备零部件归类指南》等产品与来访嘉宾展开交流，欢迎莅临展位参观交流。泓明正从传统物流迈向AI原生供应链，为我国集成电路产业锻造更具韧性的供应链底座。
From October 12 to 16, the 2026 China International Industry Fair · Integrated Circuit Exhibition (IC Expo) was held at the National Exhibition and Convention Center (Shanghai). HMG Group presented multiple innovative achievements in its AI-native supply chain.
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IC Glory: Honored with the Ecosystem Partner Award
HMG Group received the "Ecosystem Partner Award." This award was presented by an industry association to recognize ecosystem partners that have made outstanding contributions to collaborative innovation across the integrated circuit industry chain.
Forum Speech: From "AI-Enhanced" to "AI-Native
On the afternoon of October 13, the 2026 Conference on Upstream and Downstream Collaborative Innovation and Development of Integrated Circuit Equipment, Materials and Components was held at the National Exhibition and Convention Center (Shanghai). David Hong, Digital & Intelligent Solution Director of HMG Group, delivered a speech titled "
"Under the Disruption: Resilience Rises to a Strategic Issue." The integrated circuit supply chain is facing four overlapping pressures: geopolitical and control escalation, drastic shifts in demand structure, increased compliance intensity, and dual pressure on time and cost.
In the traditional "AI-enhanced" model, AI is an external tool outside the process; data is designed for people first, and inconsistent semantics make model output impossible to verify. HMG's "AI-native" path embeds agents within processes, where business steps are intelligent nodes, and data and semantics are prepared for AI first.
On October 13, the Shanghai Channel of People's Daily Client published a report titled "At the CIIF, AI-Native Supply Chain Gains Momentum," covering HMG Group's multiple industrial innovation achievements at the IC Expo.
The report noted that the Trade Compliance Agent, Supply Chain Digital Twin Warehouse, Full-Chain Digital-Intelligent Temperature-Controlled and Vibration-Damping Transportation Solution, and the "Classification Guide for Components of Integrated Circuit Manufacturing and Packaging & Testing Equipment" 2.0 were showcased together.
编辑 | 泓明数字营销部
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