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国芯展首日丨泓明AI产品矩阵亮相国芯展 数智科技赋能半导体供应链

国芯展首日丨泓明AI产品矩阵亮相国芯展 数智科技赋能半导体供应链 泓明链动产业
2026-10-12
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数智科技赋能半导体供应链

泓明AI产品矩阵

亮相国芯展


2026年10月12日,第26届中国国际工业博览会·集成电路展(国芯展)在国家会展中心(上海)盛大开幕。本届工博会首次设立独立的集成电路主题展区,吸引来自全球24个国家和地区的3200余家中外展商参展。当日下午,泓明集团“AI原生·智链万物”发布会在5.2H馆B021展位隆重举行,泓明集团物流总经理吴文忠、数智化解决方案总监洪世畅等出席,与现场嘉宾、行业同仁及线上直播间观众共同见证泓明从“数智化”迈向“AI原生”的关键一跃。



01

三十年积淀,宣告第二次跨越



发布会伊始,泓明集团CTO高建先生在致辞中回顾了企业深耕集成电路产业供应链三十年的发展历程。“三十年前,泓明从保税区一方天地起步;今天,我们站在国芯展的舞台上发布四项数智成果。变的是技术,不变的是服务中国集成电路产业的初心。 ”



致辞指出,供应链正在从数字化走向智能体时代。“产业供应链要的,不是会聊天的AI,而是懂晶圆、懂归类、懂海关规则、能把事情办成的AI。”泓明历经多年沉淀,积累了规模化的物料语义标注,系统化处理了大量集成电路相关商品,拆解了报关单中的诸多非标字段,并汇集成体系的书籍文献、政策法规与合规咨询语料,构筑起别人难以复制的数据底座。

02
四项数智成果集中发布


发布会现场,泓明集团数智化解决方案总监洪世畅先后介绍了商品归类智能体、贸易合规智能体、供应链数字孪生仓库;泓明集团物流总经理吴文忠介绍了全链路数智恒温避震运输方案;《集成电路制造与封测设备零部件归类指南》2.0由机电商品归类资深顾问温朝柱教授介绍。



商品归类智能体:数据治理驱动的“数据+规则”双轮引擎




作为贸易合规智能体的核心数据治理引擎,商品归类智能体成为本场发布会最受关注的焦点。半导体设备横跨84章、85章、90章多个品目,专用件与通用件的判定长期依赖老师傅经验。智能体以本体语义框架为底座,将商品信息拆解为材质、用途、工艺、专用性等结构化要素,自动完成预归类,将数小时的人工审核压缩至分钟级,并联动出口管制筛查、原产地判定与许可证管理,实现“一次归类、三账同步”。



发布会现场演示了智能体的完整推理链路:输入商品描述后,系统依次完成事实提取、概念匹配、规则召回、历史召回、合并裁决,输出Top5候选编码及置信度评分,每个候选均附带六段式推理依据,全程可追溯、可审计。人的角色并未消失——规则清晰、数据充分的标准商品交给智能体,依据不足、无先例可循的疑难商品交给归类专家,专家判断再回流训练,越用越准。



与智能体配套发布的,是同步迭代的《集成电路制造与封测设备零部件归类指南》2.0。2.0版本补齐封测后道内容,新增键合、贴装、测试章节,实现前道、中道、后道全产业链覆盖,重点覆盖先进封装与化合物半导体制造设备。指南把行业共识沉淀为规则底座,智能体的实战经验反哺指南迭代——智能与标准双向咬合。


贸易合规智能体:让合规风险提前可知、全程留痕




基于泓明多年沉淀的专属合规知识资产,贸易合规智能体将散落在政策、案例、术语与专家经验中的专业判断,转化为可复用、可审计、可解释的智能问答能力。与通用大模型相比,回答更简洁、不产生幻觉,基础咨询秒级响应。目前已打通CIS税则基础参数库,支持中、英、日、韩多语言交互,帮助企业规避因政策理解偏差带来的合规风险。




供应链数字孪生:从被动响应到主动预防




3D建模与IoT传感融合,实现库内作业全景可视与异常自动预警。在物流层面,结合GIS实时路况与运输轨迹,构建端到端仿真模型,支持路径预演与时效预测。管理者可以在数字世界中预演每一种可能,提前发现问题、优化方案,让决策从被动响应走向主动预防。



订单控制塔是面向物流与供应链的智能协同决策平台。依托统一数据底座、语义引擎与AI,贯通订单到交付全流程,实时整合多维信息,实现过程可视、指标可量、异常可警、决策可溯,并生成AI洞察,推动协同优化,提升效率、准时率、准确率与客户服务水平,打造透明、高效、敏捷、智能的供应链体系。



全链路数智恒温避震运输方案:让精密货物安全走普货






全程温控箱搭配专业减震装置,无需插电即可维持23℃±2℃温控,环境数据实时回传、全程可视。1536公里普货零担真实路测已验证,重点服务上海及长三角跨境精密运输场景。方案以“不卖包装箱,卖恒温+避震+保险+仓网一体化服务”为核心逻辑,让高价值精密货物从“专车/气垫车/高保费”转化为“普货零担/低风险/低保费”,在运价与保费之间创造利润空间。

四项成果组合起来,就是“精密交付—数字底座—合规智能—标准输出”的完整能力。对半导体产业的价值可以概括为三点:合规更准、响应更快、韧性更强。

03

高峰论坛同期举行 展位活动持续开放




同日下午,集成电路高峰论坛在国家会展中心举行。院士专家与产业链龙头企业负责人围绕制造、装备、EDA、材料、先进封装、AI芯片等全链条展开交流,泓明集团深度参与高峰论坛。



10月12日-16日期间,泓明展位持续开放,届时将通过有奖活动、互动演示、专人讲解等形式,集中介绍泓明核心服务优势。欢迎莅临交流洽谈。

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Intelligent Technology Empowers the Semiconductor Supply Chain

HMG AI Product Matrix Debuts at IC Expo


On October 12, 2026, the 26th China International Industry Fair (CIIF) · Integrated Circuit Exhibition (IC Expo) grandly opened at the National Exhibition and Convention Center (Shanghai). 

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01

Three Decades of Accumulation, Announcing the Second Leap



At the beginning of the launch event, a representative of HMG Group reviewed the company's 30-year development history of deeply cultivating the integrated circuit industry supply chain in the speech. "Thirty years ago, HMG started from a small space in a bonded zone; today, we stand on the stage of the IC Expo to release four digital-intelligent achievements. 


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02
Four Digital-Intelligent Achievements Released



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Commodity Classification Agent: A "Data + Rules" Dual-Wheel Engine Driven by Data Governance



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As the core data governance engine of the Trade Compliance Agent, the Commodity Classification Agent became the focus of the launch event. Semiconductor equipment spans multiple headings in Chapters 84, 85, and 90, and the determination of dedicated parts versus general-purpose parts has long relied on the experience of veteran masters. 


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The launch event demonstrated the agent's complete reasoning chain: after inputting a commodity description, the system sequentially performs fact extraction, concept matching, rule recall, historical recall, and merged adjudication, outputting the Top 5 candidate codes and confidence scores. Each candidate is accompanied by a six-part reasoning basis, and the entire process is traceable and auditable. 


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Released alongside the agent was the synchronously iterated Classification Guide for Components of Integrated Circuit Manufacturing and Packaging & Testing Equipment 2.0. Version 2.0 fills in the back-end packaging and testing content, adds chapters on bonding, placement, and testing, and achieves full industry chain coverage of front-end, mid-end, and back-end, with a focus on advanced packaging and compound semiconductor manufacturing equipment.

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Trade Compliance Agent: Making Compliance Risks Known in Advance and Fully Traceable




Based on HMG's proprietary compliance knowledge assets accumulated over many years, the Trade Compliance Agent transforms professional judgments scattered across policies, cases, terminology, and expert experience into reusable, auditable, and explainable intelligent Q&A capabilities. 




Supply Chain Digital Twin : From Reactive Response to Proactive Prevention




The integration of 3D modeling and IoT sensing enables panoramic visibility of in-warehouse operations and automatic anomaly alerts. At the logistics level, it combines GIS real-time traffic conditions and transportation trajectories to build an end-to-end simulation model, supporting route rehearsal and timeliness prediction. 



The Order Control Tower is an intelligent collaborative decision platform for logistics and supply chains. Powered by a unified data foundation, semantic engine, and AI, it connects order-to-delivery, integrates real-time data, and enables visibility, measurable KPIs, anomaly alerts, and traceable decisions. AI insights drive collaborative optimization, improving efficiency, on-time delivery, accuracy, and customer service, and creating a transparent, efficient, agile, and intelligent supply chain.



Full-Chain Digital-Intelligent Temperature-Controlled and Vibration-Damping Transportation Solution: Letting Precision Cargo Travel Safely as General Cargo





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The full-process temperature-controlled container is equipped with professional vibration-damping devices, maintaining 23°C ± 2°C temperature control without plugging in, with environmental data transmitted in real time and visible throughout the journey. 

Together, the four achievements form a complete capability of "precision delivery—digital foundation—compliance intelligence—standard output." 

03

Summit Forum Held Concurrently, Booth Activities Continue




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On the same afternoon, the Integrated Circuit Summit Forum was held at the National Exhibition and Convention Center. Academicians, experts, and heads of leading enterprises in the industry chain exchanged views on the full chain of manufacturing, equipment, EDA, materials, advanced packaging, AI chips, etc. 


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From October 12 to 16, the HMG booth will remain open, presenting HMG's core service advantages through prize-winning activities, interactive demonstrations, and dedicated explanations.


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编辑 | 泓明数字营销部

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泓明供应链集团于1995年创始于中国(上海)自由贸易试验区,深耕中国集成电路产业供应链20年,是中国数智化产业供应链服务引领者。集团总部位于张江科学城,在全国17个城市建立了31个产业供应链物流中心。
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泓明链动产业 泓明供应链集团于1995年创始于中国(上海)自由贸易试验区,深耕中国集成电路产业供应链20年,是中国数智化产业供应链服务引领者。集团总部位于张江科学城,在全国17个城市建立了31个产业供应链物流中心。
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