大数跨境
首页
>
今日PCB｜行业每日动态 Global PCB Daily Roundup
>

今日PCB｜行业每日动态 Global PCB Daily Roundup

今日PCB｜行业每日动态 Global PCB Daily Roundup 电子制造出海资讯
2026-09-15
5
导读：PCB 24小时看点：国家级十五五电子信息规划落地，将 PCB、IC 载板、高频覆铜板上升为国家级攻关赛道；A
PCB 24小时看点：国家级十五五电子信息规划落地，将 PCB、IC 载板、高频覆铜板上升为国家级攻关赛道；A 股 PCB / 覆铜板板块继续走强，主力资金净流入明显； AI 算力链对PCB全行业的拉动已从中国扩散到韩国、北美与全球供应链。

① 工信部 + 发改委印发电子信息制造业 "十五五" 规划，高频高速 PCB、IC 载板、高频高速覆铜板列入国家级攻关重点

9月15日，工信部、国家发改委正式发布《电子信息制造业发展 “十五五” 规划》。规划明确提出，面向 AI、通信、航天领域，攻关高频高速、高层高密度 PCB、IC 载板，同步发展高频高速覆铜板、低轮廓铜箔等上游核心材料，推动PCB产业链高端化、国产化。规划设定目标：至2030年电子信息制造业营收突破30万亿元，PCB及配套材料作为基础元器件重点赛道。
On September 15, MIIT and NDRC jointly released the 15th Five-Year Plan for Electronic Information Manufacturing. It targets high-frequency high-speed, high-layer high-density PCBs and IC substrates for AI, telecom and aerospace, plus upstream high-speed CCL and low-profile copper foil. By 2030, the sector’s revenue will exceed RMB 30 trillion, with PCB and its materials as core basic components.

② 9月15日A股PCB / 覆铜板板块走强，覆铜板指数盘中大涨超5%，板块主力资金净流入55.81亿元

9月15日A股盘面，覆铜板概念盘中涨幅一度突破 5%，华正新材涨停，方邦股份盘中最大涨幅15%，南亚新材、生益科技、超声电子同步跟涨；澳弘电子收获3连板。截至收盘PCB板块整体上涨0.58%，119只相关标的上涨，板块主力资金净流入55.81 亿元。券商观点：Q3覆铜板涨价效应逐步传导至 PCB 成品端。
On Sept 15, A-share CCL index surged over 5% intraday. Huazheng hit limit-up, Fangbang rose 15% intraday; Nan Ya, Shengyi, Goworld followed. Aohong recorded 3 consecutive limit-ups. The PCB sector closed +0.58%, with RMB 5.581bn net inflow of main capital. Brokers note CCL price hikes are gradually passing down to finished PCB products in Q3.

③ 景旺电子泰国投产庆典

景旺泰国基地位于巴真府甲民武里金池工业园，一期投资20亿元，满产月产能10万㎡，主打 40 层以上高多层板、任意阶互连HDI，面向AI 服务器、汽车电子。该基地是景旺首个海外生产基地，完善全球化供应链布局，规避贸易壁垒。
manufacturing 40+ layer high-multilayer boards and any-layer HDI for AI servers and automotive electronics. It is Kinwong’s first overseas manufacturing site to optimize global supply chain and mitigate trade risks.

④ I-Connect007｜9月14日发布报告：PCB等离子表面处理设备2026-2031持续高增长

等离子表面处理设备在PCB、先进封装领域需求持续上行，预计2026至 2031年市场规模保持稳定增长。该设备用于PCB孔壁活化、去除残胶，是 HDI、IC 载板生产的关键工艺设备；AI 载板大规模扩产带动设备订单持续释放。
Plasma surface preparation equipment will maintain steady growth from 2026 to 2031. Widely used for desmear and hole activation in HDI and IC substrate manufacturing, demand is boosted by capacity expansion of AI substrates.

⑤ 宏昌电子高端覆铜板定增项目9月14日晚间更新环评进展

9月14日晚间，宏昌电子公告更新 18亿元定增项目环评推进状态。项目落地珠海，投产后新增高端覆铜板1320万张 / 年、半固化片3120万米 / 年，产品供给 AI 服务器、数据中心。目前环评、土地备案手续加速推进，有望在年内完成前期审批。
On the evening of Sept 14, Hongchang Electronics updated EIA progress of its RMB1.8bn private placement project in Zhuhai. The project will add 13.2 million high-end CCL sheets and 31.2 million meters prepreg annually for AI servers and data centers. EIA and land filing are accelerating.

⑥ IPC9月14日发布AI算力板可靠性更新标准

9月14日 IPC发布电子组装可靠性简报，针对AI服务器高速PCB提出新的可靠性测试参考标准，重点优化高低温循环、阻抗稳定性测试方案，适配高功耗 AI 算力板，后续将开放给全球PCB、组装厂商参考。
IPC released electronics assembly reliability brief on Sept14, updating reliability testing references for high-speed AI server PCBs. It optimizes thermal cycling and impedance stability tests for high-power AI boards, available for global PCB and EMS manufacturers.

⑦ Circuits Assembly 9月14日：AI算力PCB 检测设备订单激增，AOI设备厂商扩产交付能力

伴随AI服务器PCB产能扩张，在线AOI光学检测设备订单大幅增长。高端高多层板、载板对缺陷检测精度要求大幅提升，设备厂商加速扩充产能，缩短交付周期，全球PCB检测设备交付周期普遍拉长至16–22周。
Circuits Assembly reported on Sept 14 that orders for AOI inspection equipment surged alongside AI server PCB capacity expansion. High-layer boards and substrates require ultra-precise defect inspection. Equipment makers ramp up production to shorten lead times; global AOI lead times stretch to 16–22 weeks.

⑧ KPCA 9月14日发布：韩国本土HDI产能优先供给韩国AI 芯片与终端厂商

 KPCA 发布行业动态，韩国本土HDI产线产能分配策略调整，优先保障本土 AI芯片、消费电子头部企业订单。海外客户的HDI订单交期拉长，部分订单顺延至2027年一季度，全球HDI供给结构性紧张持续。
KPCA (Korea Printed Circuit Association) released industry news on Sept14. Local Korean HDI capacity is prioritized for domestic AI chip and consumer electronics firms. Lead times for overseas HDI orders are extended, some pushed to Q1 2027; structural HDI shortage continues.

⑨国内低轮廓铜箔企业加速扩产，配套IC载板材料需求

国内多家铜箔厂商加快低轮廓超薄铜箔产线建设。IC载板、高频高速PCB对低轮廓铜箔需求快速增长，当前高端超薄铜箔国产化率不足，头部材料企业加大研发与资本开支，匹配PCB载板国产替代节奏。
On the evening of Sept 14, Elecfans reported domestic copper foil makers accelerate low-profile ultra-thin copper foil capacity. IC substrates and high-speed PCBs drive strong demand. Localization rate of high-end ultra-thin copper foil remains low; material firms increase CAPEX to support PCB substrate localization.

⑩ PCB干膜价格Q4预计继续小幅上行，原材料树脂成本支撑

Global SMT & Packaging 9月14日材料市场分析，PCB感光干膜原材料树脂价格维持高位，行业预判Q4全球干膜报价延续小幅上行趋势。高端HDI、IC 载板专用干膜供给偏紧，价格涨幅将高于普通FR4板材配套干膜。
Global SMT & Packaging released material market analysis on Sept14. Resin raw material costs stay high; PCB dry film prices are expected to rise moderately in Q4. Dry film for HDI and IC substrates is tighter, with higher price growth than standard FR4 dry film.

⑪AI服务器PCB订单结构分化，高速板溢价维持，普通多层板竞争激烈

当前全球PCB订单出现明显分化：AI服务器高速高多层板、IC载板保持高溢价，订单饱满；传统普通多层板、低端单双面板市场竞争激烈，价格承压，中小 PCB 厂商盈利压力加大。
ESM China published survey on Sept15. Global PCB orders show obvious divergence: high-speed AI server PCBs and IC substrates maintain premium pricing and full order books. Standard multi-layer and low-end single/double-sided boards face fierce competition and price pressure, squeezing profits for small & medium PCB makers.

⑫ 北美PCB厂商聚焦军工 / 航天高端 PCB，民用算力板产能投入谨慎

PCB Directory 9月14 日发布全球厂商动态，北美本土PCB企业策略持续分化，多数厂商将资源倾斜军工、航天、医疗高端PCB赛道，对于AI民用算力板的资本开支较为谨慎，不愿大规模扩产，依托本土供应链优势做高附加值产品。
PCB Directory global brief Sept14: North American PCB makers focus resources on aerospace, defense and medical high-end boards. They remain cautious on large CAPEX for commercial AI server PCBs, preferring high-margin products leveraging local supply chains.

⑬ 国内高校联合PCB企业完成新型高频低损耗板材实验室技术验证

9月15日，国内高校联合本土PCB材料企业完成一款新型高频低损耗覆铜板实验室验证。该材料面向毫米波通信、高端AI算力板，介电损耗指标对标海外高端产品，下一步将进入中试阶段，有望降低国内高频板材料对外依赖。
Jiwei reported Sept15: A Chinese university collaborated with local PCB material firm and completed lab validation of new low-loss high-frequency CCL. Targeted for mmWave communication and high-end AI boards, its dielectric loss matches overseas premium grades. Pilot production will start next, helping reduce reliance on imported high-frequency materials.

⑭ 韩国AI载板材料依赖日台问题突出，本土树脂与铜箔国产化提速

HE ELEC 9月14日分析，韩国AI载板产业扩张迅速，但高端树脂、超薄铜箔、电子布仍高度依赖日本与中国台湾进口。为降低供应链风险，韩国本土材料企业正加速国产化验证，部分车用与AI载板材料已进入小批量导入阶段。
THE ELEC reported on Sept14 that South Korea’s AI substrate industry is expanding fast, but high-end resin, ultra-thin copper foil and e-cloth remain heavily dependent on Japan and Taiwan. Local material firms are accelerating domestic validation, with some automotive and AI substrate materials entering small-volume production.

⑮ Semiconductor Digest 9月14日：AI加速器与 HBM封装拉动IC载板需求，基板供应商进入长约谈判期

AI加速器、HBM 封装与高速交换机对IC载板需求持续超预期，头部芯片厂商正与基板供应商签订更长期供货协议，以锁定2027-2028年产能。高频高速基板、FC-BGA 与封装基板交期继续延长，价格谈判重心转向长期产能保障。
Semiconductor Digest reported on Sept14 that demand for IC substrates from AI accelerators, HBM packaging and high-speed switches continues to exceed expectations. Leading chipmakers are negotiating longer-term supply agreements to secure 2027–2028 capacity. Lead times for high-speed substrates, FC-BGA and packaging substrates remain extended.

【声明】内容源于网络
0
0
电子制造出海资讯
帮助电子制造（PCB）企业做好东南亚出海，整合泰国、越南、马来西亚本地资源，提供企业出海本地化一站式服务：专业人才招聘会、泰语驻厂培训、电子传媒、电子博览会、商务考察、办公场地、让企业有更广阔的发展空间
内容 288
粉丝 0
电子制造出海资讯 帮助电子制造（PCB）企业做好东南亚出海，整合泰国、越南、马来西亚本地资源，提供企业出海本地化一站式服务：专业人才招聘会、泰语驻厂培训、电子传媒、电子博览会、商务考察、办公场地、让企业有更广阔的发展空间
总阅读3.1k
粉丝0
内容288