From April 24 to May 3, 2026, the 2026 Beijing International Automotive Exhibition (Auto China 2026), themed "Leading the Era · Smart Future," was grandly held at the China International Exhibition Center (Shunyi) and Capital International Exhibition Center of China. With a total exhibition area of 380,000 square meters, the event set a new record for the Beijing auto show and topped the global auto show scale rankings, establishing itself as a key innovation benchmark for the global automotive industry.
At this premier global automotive event, the Shenzhen Automotive Electronics Industry Association (SZAEIA), together with nearly 40 member enterprises possessing proprietary core technologies, formed the Shenzhen Automotive Electronics Technology Exhibition Group. The group covered a total exhibition area of over 1,000 square meters, showcased a collaborative innovation chain spanning from foundational components to system-level mass production, with a deep focus on smart cockpits, starry sky headliners, automotive-grade chip components, high-power wireless charging, on-board chargers (OBC), intelligent connectivity and vehicle communication, storage solutions, LiDAR, sensors, connectors and wiring harnesses, motor and electronic control, new energy thermal management and power conversion, testing and certification, information security, and the broader electronics ecosystem.
Throughout the exhibition, the Shenzhen Automotive Electronics Technology Exhibition Group attracted numerous distinguished guests who paused to engage in meaningful exchanges. They moved between the exhibition group's various booths, observing product demonstrations one by one, experiencing cutting-edge technologies firsthand, and frequently stopping to exchange contact information with booth representatives—laying the groundwork for in-depth technical and business negotiations. The visiting guests included representatives from major domestic and international OEMs, leading Tier 1 suppliers, and professional visitors from multiple regions around the world, including (in no particular order): BYD, Geely Automobile, Great Wall Motors, Changan Automobile, FAW Group, FAW Hongqi, FAW-Volkswagen, FAW Fusheng, Dongfeng Motor, Dongfeng Automobile, Dongfeng Liuzhou Motor, Seres, Chery, Chery Jetour, BAIC Group, GAC Group, Volkswagen Anhui, XPeng, SAIC-GM-Wuling, Liuzhou Wuling, AITO, STELATO, Lynk & Co, Zeekr, Jiangling Motors, Jiangling New Energy, Yutong Bus, SANY Heavy Industry, SANY Heavy Truck, Mercedes-Benz, Hyundai Motor, Delle, Rox Motor, Boluda Malaysia, and other OEM guests; as well as Tier 1 guests from companies including Hangsheng Electronics, Huawei, Weichai Power, Panasonic, CVTE, Tuopu Group, Fawer, NavInfo, Chery Technology, Tianhai Auto Electronics, BICV, Tsingshan Industrial, Xinghe Zhilian, Zhengzhou Senptec; and also professional visitors from overseas, including Germany, France, Spain, Poland, Australia, Dubai, South Korea, Malaysia, India, Indonesia, Japan, Mexico, Republic of Ghana, Morocco, and more.
Ye Shengji, Chief Engineer of the China Association of Automobile Manufacturers (third from left)
Gao Runfeng, Deputy General Manager of China National Machinery International Co., Ltd. (center)
Yang Hong, President of SZAEIA and Chairman of Shenzhen Hangsheng Electronics Co., Ltd. (second from left)
Tang Shangxing, Deputy Director of Shenzhen New Energy Vehicle Industry Office (third from right)
Huang Wanyong, Secretary of the Jiujiang District Committee of Wuhu City, Anhui Province (second from right)
Yang Zekun, Party Secretary and Chairman of FAW Foundry (center)
Zhang Zhizhou, General Manager of FAW Greater Bay Area Research Institute (left)
Zhang Shuyuan, General Manager of Purchasing Center, Dongfeng Liuzhou Motor (right)
Du Chaoxi, Senior Expert, Intelligent Connectivity Development Department, Dongfeng Nissan Technical Center (left)
Yu Jie, Director and Executive President of Hangsheng Group (second from left)
The companies participating in the Shenzhen Automotive Electronics Technology Exhibition Group at Auto China 2026 include (in no particular order): Hangsheng Electronics, Skyworth Automotive Intelligence, Huake Tek, ENOK Communication, HIKSEMI, Silicon Motion, LEN Technology, BIWIN, BRUSA, SIT, Genvict Automotive Electronics, China Chips Star Semiconductor, FocalTech, SUNNET, CoreTK, GosuncnWelink, HengDrive, New Grand, SES Group, EXSENSE Electronics, Cenker Technology, Fuyulong, ARCTIC TEC, MemsFrontier, Blue Asia Technology, TIAN LAI, Litra Technology, Eyang Technology, Microgate, Kinglight Optocoupler, XinXin Semiconductor, Baoling Electronics, VIIYONG Technology, Zhongzhi Instruments, Geehy Semiconductor, Tianli Auto Electronics, Muku Technology, Xinchangcheng, Sunray Auto Tech, and others. Among them: 7 are listed companies, 35 are national high-tech enterprises, 24 are specialized, refined, differential and innovative enterprises, and 13 are Tier 1 level enterprises. One company has an annual output value exceeding 100 billion yuan, 10 companies exceed 1 billion yuan, and 21 companies exceed 100 million yuan.
Glimpses of the Shenzhen Automotive Electronics Technology Exhibition Group
Connecting the World, Powering the Future with Intelligence. The appearance of the Shenzhen Automotive Electronics Technology Exhibition Group at Auto China 2026 not only showcased the core products and technical strengths of the member enterprises in their respective fields, but also fully demonstrated the significant bridging role of the Shenzhen Automotive Electronics Industry Association in aggregating innovation resources and deepening industry chain collaboration. As globalization accelerates, the Association will continue to promote deeper engagement between a growing number of local enterprises and global OEMs and overseas customers, jointly drawing a new blueprint for the intelligent automotive industry through close upstream and downstream collaboration.