浙江博来纳润电子材料有限公司创立于2021年，专注于为半导体行业平坦化材料提供整体解决方案，其旗下子公司包括上海映智研磨材料有限公司（研发中心）、衢州博来纳润电子材料有限公司（生产基地）、杭州博来纳润电子材料有限公司（研发中心）。

博来纳润致力于CMP材料国产化，提供硅溶胶、抛光液、抛光垫等电子材料，应用领域涵盖碳化硅衬底CMP制程、硅衬底CMP制程、集成电路CMP制程、其他泛半导体CMP制程等。

Zhejiang Planary Electronic Materials Co., Ltd., was founded in 2021, focusing on providing comprehensive solutions of material planarization for the semiconductor industry. Its subsidiaries include Shanghai Yingzhi Polishing Materials Co., Ltd. as its main R&D center, Quzhou Planary Electronic Materials Co., Ltd. as its production base, and hangzhou Planary Electronic Materials Co., Ltd. as another R&D center.

Planary is committed to the domestic solutions of chemical machanical planarization (CMP) materials, providing silica sols, polishing slurries, polishing pads and other process consumables. The realated application areas include SiC substrate CMP, silicon substrate CMP, integrated circuit CMP, and other semiconductor CMP processes.

博来纳润高纯磨料包含高纯硅溶胶和氧化铝，主要用于半导体CMP制程。其中高纯硅溶胶采用离子交换法制备，金属离子总量低于100 ppm。超纯硅溶胶采用超高纯度有机硅原料，其金属离子含量可控制在1ppm以内。

Planary’s high purity abrasives include high purity silica sols and high purity alumina, mainly used for semiconductor CMP. The high-purity silica sols are prepared by ion exchange method, with total metal ion concentration is less than 100 ppm. Ultra-pure silica sols have total metal ion concentration ess than 1 ppm, with the use of ultra-high purity silanes as raw materials.

SCCS系列切割油适用于碳化硅线切割加工，粘度可根据客户工艺，进行产品定制，产品悬浮分散性能优异，金刚石浆料稳定性较好，粘度稳定，易清洗。

The SCCS series slicing oils are suitable for SiC wire slicing processing, with customizable viscosity. They have excellent process properties, including: extraordinary dispersion, suspension, and stabilization of diamond micro powders, stable viscosity during storage and slicing processes, and convenient to clean.

COLAP系列研磨液可用于碳化硅双面粗磨和双面精磨，选用采用单晶,类多晶和多晶金刚石粉，研磨液悬浮性好，粘度稳定，磨削力高，研磨质量好。

COLAP series lapping slurries are used for rough lapping and fine lapping of SiC, with monocrystalline, polycrystalline-like, and polycrystalline diamond powders for different grades. These lapping slurries have good suspension, stable viscosity, high removal rate, and can deliver extraordinary surface quality.

COPOL系列抛光液是以SiO2、Al2O3、MnO2、CeO2为磨料高锰酸钾体系和氧化硅过氧化氢体系的碳化硅抛光液，可应用于碳化硅双面CMP、C-CMP、Si-CMP以及一步抛光。产品速率高且稳定、循环使用寿命长，抛光后表面无划伤，良品率高。

COPOL series polishing slurries employ potassium permanganate as oxidant coupled with selected abrasive particles including silica sols, Al2O3, MnO2, and CeO2 for rough polishing, and hydrogen peroxide coupled with silica sols for fine polishing. The permanganate based slurries may be used for SiC’s double-side, C-side, Si-side, and one-step CMP. These products have high and relatively stable polishing rate & long cycle life, and can deliver good surface quality and high process yield.

碳化硅用抛光垫包含聚氨酯抛光垫、无纺布抛光垫、阻尼布抛光垫，可应用于碳化硅精磨、双面CMP、单面CMP以及一步抛光。抛光垫去除速率高、使用寿命长、良品率高。

The pads for SiC processing include polyurethane pads, non-woven pads, damping pad, which can be applied to fine lapping, double-side CMP, single-side CMP and one-step CMP. These pads deliver high removal rate, long lifetime, and high process yield.