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2024 SEMICON JAPAN——Sieg 7547
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2024 SEMICON JAPAN——Sieg 7547

2024 SEMICON JAPAN——Sieg 7547 熹贾精密
2024-12-06
3
导读：Sieg welcomes your visit























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 公司简介  
Company profile


熹贾精密是行业领先的高分子弹性体和高功能塑料密封产品制造商,是一家集研发、设计、加工、销售于一体的高新技术企业,拥有从材料开发到精益生产全产业链，打破行业进口垄断，保证供应链安全。
Sieg technology is an advanced manufacturer of polymer elastomers and high functional plastic sealing products. lt is a high-tech enterprise integrating research and development, design, processing and marketing, which has the whole industrial chain from material development to lean production, breaking the import monopoly of the industry and ensuring the safety of the supply chain.





公司总部位于上海奉贤,全资日本子公司负责原材料研发,江苏泰兴为化工原材料生产中心，上海奉贤工厂为半导体产品制造中心,安徽宁国工厂为车规级产品制造中心,已经通过ISO9001、IATF16949、ISO14001、ISO45001等认证。
公司利用先进的高分子聚合技术和丰富的应用经验不断开发创新型产品,为半导体、汽车、工业和生命科学客户提供高性能产品，满足各类应用工况。
The company is headquartered in Fengxian district , Shanghai , and its wholly-owned subsidiary in Japan is responsible for the research and development of raw materials. Factory in Jiangsu Taixing is the production center of chemical raw materials. factory in Fengxian district is the manufacturing center of semi-conductor products, and factory in Anhui Ningguo city is the manufacturing center of automotive products, The company has passed IS09001., IATF16949, ISO14001, ISO45001 and other certifications.
The company uses advanced polymer polymerization technology and rich application experience to continuously develop innovative products for semiconductor, automotive, industrial, life science customers with high performance products to meet a variety of application conditions.




 展会产品简介 
Exhibition Product Introduction


原材料：FFKM/特种FKM/PFA
Raw Materials: FFKM/Special FKM/PFA


公司针对半导体行业特别研发生产FFKM/特种FKM/PFA等几款国内紧缺的氟聚合物材料，摆脱半导体卡脖子原材料“受限于人“的局面，采用业内顶尖的技术控制金属离子，复合semi要求。目前FFKM O-ring等制品已经在fab端、设备端大量验证和使用。
The company has specially developed and produced FFKM/Special FKM/PFA and several other domestically scarce fluoropolymer materials for the semiconductor industry, breaking the situation where semiconductor bottleneck raw materials are "controlled by others." It uses top-notch industry technology to control metal ions and meet SEMI requirements. Currently, FFKM O-ring and other products have been extensively verified and used in FAB and equipment manufacturers.




 产品系列 
Product Series




对于半导体生产过程中使用的全氟醚密封件，材料的纯净度是首要考量。具体到不同的工艺制程，纯净度的要求有不同内涵:湿制程要求低金属离子和低有机物析出，热制程要求低气体释放，等离子体和气相沉积制程要求要求低重量损失、低颗粒产生。针对半导体不同的制程需求，熹贾精密提供完整材料解决方案。
For FFKM seals used in the semiconductor production process, material purity is the primary consideration. Specific to different process technologies, purity requirements have different contents: wet processes require low metal ions and low organic extractables, thermal processes require low outgassing, and plasma and vapor deposition processes require low weight loss and low particle generation. In response to the different process requirements of the semiconductor industry, Sieg provides a complete material solution.



 O-ring 



凭借丰富的行业应用经验和对技术挑战的深刻理解，熹贾将积累多年的密封件方面的专业知识应用于泛半导体行业。从原材料研发，到产品生产成型，公司拥有闭环产业链及标准O-ring尺寸AS568的全系列模具。对于非标准O-ring密封件，熹贾提供具有成本效益的解决方案和响应更快的服务；对于大直径O-ring密封件，熹贾提供全模制制作，在一次模压操作中用单个工具制造，同时采用分段硫化的手段可以突破单次模压的极限。
With rich industry application experience and a deep understanding of technical challenges, Sieg applies its accumulated professional knowledge in sealing parts to the general semiconductor industry. From raw material research and development to product production molding, the company has a closed-loop industrial chain and a full series of standard O-ring molds AS568. For non-standard O-ring seals, Sieg provides cost-effective solutions and faster response services; for large-diameter O-ring seals, Sieg offers full mold manufacturing, made in a single molding operation with a single tool, and segmented vulcanization methods can break through the limits of single-shot molding.



 Bonded Door Seals 


结合了一体硫化结合技术以及专为泛半导体制程开发的具备高洁净度、优异的抗等离子、高电阻性能的全氟弹性体密封材料。与传统的分离式O-ring的设计相比，Bonded Gate Valves和Bonded Slit Valve Doors的一体硫化成型设计不仅有效的减少颗粒产生，也大大延长了它的密封寿命。
Combining one-batch vulcanization bonding technology with high-purity, excellent plasma resistance, and high electrical resistance performance of perfluoroelastomer sealing materials developed specifically for the general semiconductor process. Compared with the traditional separate O-ring design, the one-batch vulcanization molding design of bonded gate valves and bonded slit valve doors not only effectively reduces particle generation but also significantly extends its sealing lifetime.





 塑料件/复合件 
 Plastic Parts/Composite Parts 


为满足客户更高的使用要求、追求更优秀的密封性能，公司还提供一系列定制化相关产品如PI、PTFE、PFA等各种塑料件、center ring、滚轮顶针等复合密封件，我们专注于高分子弹性体和高功能塑料领域，不断加强材料开发和制造能力，以更好地服务客户。
To meet customers' higher usage requirements and pursue better sealing performance, the company also provides a series of customized related products such as PI, PTFE, PFA, and various plastic parts, center rings, roller pins, and other composite sealing parts. We focus on the field of polymer elastomers and high-functional plastics, continuously strengthening material development and manufacturing capabilities to better serve customers.

















































































— Sieg welcomes your visit —

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