NEPCON China 2025 SMTA国际论坛，中美大咖共探 SMT 行业新未来揭秘电子制造海外前沿技术

讲师简介：

查尔斯鲍尔博士，高级董事总经理，TechLead 公司

作为技术、商业和市场领域的知名演讲者，鲍尔博士活跃于多个国际组织，并曾在SMTA和 IMAPS董事会任职，2001-2002年担任IMAPS主席。他荣获多项荣誉，包括Tektronix技术创新奖、IMAPS会员、SMTA国际领导力奖、耶稣高中名人堂、波特兰大学75位杰出校友、SMTA25周年纪念灯塔奖以及SMTA的创始人奖。

专注于战略技术规划、市场分析和国际业务发展，特别聚焦医疗设备，如传感器和成像系统，结合在医疗设备设计和制造的丰富经验，为技术与实际应用提供了均衡视角。拥有超过40年的行业经验，鲍尔博士在电子互连技术、封装和组装领域均有深入研究，包括印刷电路板、多芯片模块、系统级封装、30封装和纳米技术应用。他发表了超过250篇学术论文和专栏。

具体会议日程请以会议现场演讲为准，解释权归主办单位所有。

The agenda is subject to change without prior notification. Reed Exhibitions reserves the right of final interpretation

Instructor Biography:

Charles E. Bauer Ph.D, Senior Managing Directar, TechLead Carporation 

Charles E. Bauer, Ph.D, serves as Senior Managing Director of TechLead Carporation, a technology managemnent comnpany specializing in the electronics packaging.

interconnection and assembly industry, as well as Director of the University of Portland's Global Executive Leadership MBA program.Dr. Bauer focuses in the areas of strategic technology planningmarket analysis and business development, particularly in the international arena. Recent foci include an emphasis on medical device applications including sensors and imaging systems.

1.Chipliets ：我们是如何到达这里的?

通过回顾芯片作为先进电子设计和制造的架构和技术解决方案的历史，我们可以了解未来的发展方向和挑战。通过回顾迄今为止所经历的坎坷，我们预测了有待克服的障碍。演讲探讨了对成功部署现代芯片机会至关重要的几项重要技术和商业战略。具体领域包括混合键合、装配层次、基板和芯片供应链、标准化和系统级集成。

1. Chiplets: How'd We Get HERE?

A review of the histary of chiplets as an architectural and technical solution in advanced electranics design and manufacture sheds light on future directions and challenges. By reviewing the bumps in the road thus far, we anticipate the hurdles yet to overcorne. The presentation explares several significant technologies as well as business strategies crucial to successful deployment of modern chiplet opportunities. Specific areas of interest include hybrid bonding, assembly hierarchy, substrate and chip supply chain, standardization and system level integration.

2.现代奇迹—第7集

现代电子系统融合了各种令人惊叹的技术。每个技术构件都体现了令人印象深刻的创新、改进和扩展。语义命名上的争论——如SOC与异构集成——毫无益处，既不会影响产品要求，也不会影响可用的技术构件。

本谱系侧重于构成现代奇迹的多种技术，我们称之为异构集成(SP、20/25/3.0D等）。基底、互连和架构在过去75年中不断发展，形成了协调现代电子奇迹的技术系列。本综述强调了应用和重新应用历史经验和见解来应对当今挑战的机会。

2.Moder Marvels-Episode7

Modern electronic systems incorporate a wide range of marvelous technologies. Each technological building block, in turn, embodies impressive innovation, refinement, and scaling. Semantic naring debates- think SOC vs heterogeneous integration-contribute nothing, influencing neither product requirements nor the available technological building blocks.

This ganealogy focuses an multiple technologies comprising the modern marvel we call heterogeneous integration [SiP, 2.0/2.5/3.0 D,etc.].

Substrates, interconnect and architecture, evolving throughout the past 75 years, form the technology farilies orchestrating the marvels of modern electronics. This review highlights opportunities to apply and reapply learnings and insights from history to today's challenges. 

未来SMT行业趋劳

1.海外如何评价中国电子制造行业工艺现状及发展可能

2.全球电子产业技术交流及互动可能性

3.全球电子产业如何实现合作共赢

4.中国电子行业发展展望

Future SMT industry trends

1. How overseas evaluates the process status and development possibilities of China's electronics manufacturing industry

2. Glabal electronics industry technology exchanges and interaction passibilitias

3. How to realize win-win cooperation in global electronics industry

4. China electronics industry development outlook