新品预告
随着AI训练集群规模突破百万卡级、算力需求迈入Zettascale时代，数据中心对超高带宽、超低时延与极致能效的要求达到新高度。
华工正源（HGGenuine）全球首发新品—1.6T OSFP 2xFR4 3nm DSP光模块，以技术创新突破物理极限，并将在OFC2025进行全链路实时演示。
As AI training clusters scale to millions of accelerator cards and computing demands enter the Zettascale era, data centers now require unprecedented levels of ultra-high bandwidth, ultra-low latency, and extreme energy efficiency. Addressing these challenges, HGGenuine has globally unveiled a groundbreaking product—the 1.6T OSFP 2xFR4 3nm DSP Optical Module. Leveraging full-stack technological innovations that push the boundaries of physics, the module will debut a full-link real-time demonstration at the 2025 OFC Conference.
1.6T OSFP 2xFR4 3nm DSP光模块
集成3纳米制程DSP芯片
Integrated 3nm DSP Chip
芯片功耗较前代降20%
20% reduction in chip power dissipation compared to the previous generation
支持单通道200G PAM4调制
Supports single-channel 200G PAM4 modulation
1.6T OSFP 2xFR4 3nm DSP光模块
重新定义光互联密度与能效边界
This solution redefines the boundaries of optical interconnect density and energy efficiency
可支撑下一代102.4T交换机、万亿参数AI集群
This solution provides a bottleneck-free transmission backbone for next-generation 102.4T switches and trillion-parameter AI clusters.
为超大规模算力提供无瓶颈传输底座
It ensures seamless, ultra-large-scale computing power delivery to meet the explosive demands of Zettascale-era infrastructure.
华工正源新品发布会
预约通道：www.genuine.com
OFC2025
1.6T OSFP 2xFR4 3nm DSP光模块
实时展示
Booth# 1842
（注：本文提及的技术参数均通过第三方实验室验证，具体产品信息以发布会为准）
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