尊敬的客户与合作伙伴们：
UTAC集团诚挚邀请您莅临第31届中国集成电路设计业展览会（ICCAD 2025），与我们共赴成都之约！作为全球半导体封装与测试服务的领先企业，UTAC集团将首次以更强大的技术阵容亮相这一行业盛会，展示覆盖封装、测试解决方案及车规级芯片的全方位能力。
时间：2025年11月20-21日
地点：成都·中国西部国际博览城
UTAC展位号：D49/50/63/64
2024年，UTAC以强势回归赢得市场关注；2025年，我们以更坚实的技术底蕴与合作诚意，期待在成都与您相见！
共赴ICCAD 2025，携手UTAC，共绘芯片产业新图景
Dear Clients and Partners,
UTAC Group cordially invites you to visit us at the31st China Integrated Circuit Design Conference & Exhibition (ICCAD 2025),as we gather in Chengdu! As a global leader in semiconductor packaging and testing services, UTAC will debut at this premier industry event with an even stronger technological lineup, showcasing comprehensive capabilities spanning packaging, testing solutions, and automotive-class semiconductors.
Date:November 20–21, 2025
Location: China • Chengdu • Western China International Expo City
UTAC Booth: D49/50/63/64
In 2024, UTAC captured market attention with a powerful comeback. In 2025, with deeper technological expertise and a stronger commitment to collaboration, we look forward to meeting you in Chengdu!
Join us at ICCAD 2025 and partner with UTAC to shape a new landscape for the semiconductor industry!
