林德大中华区热招岗位 : APP Sales Engr-Electronic Package - 应用技术销售工程师-电子封装

Title: Application Sales Engineer - Electronic Package
Report to: Application Sales Manager - Metals & Glass
Department: Bulk
Location: Shanghai

Role Description:

1. Be the key person to lead the application technology selling in Electronic Package segment.

2. Be responsible for RGC Electronic Package market strategy, and lead the strategy implementation.

3. Ensure RGC achieves the most profitable growth by selecting and implementing application technologies in the segment.

Primary Responsibility:

1. Interface/technology receiver role:
   - Be partner to BA Marketing and Technology regarding application technology selling, development and best commercial practice sharing.
   - Lead the Joint Activity Planning to align RGC demand with BA support.
   - Work with global PLCM closely, lead complex technology selling in the market.

2. Expert role:
   - Industrial segment market intelligence, market analysis and strategy development.
   - Be expert in application technology and best commercial practice.
   - Deliver expertise to area ASE teams and other sales teams. Train on applications and introduce new products.
   - Support area ASE teams with expertise to drive technology selling.

3. Application technology selling role:
   - Functionally Lead the Market Segment (the allocated application engineers).
   - Be responsible for Realized Revenue follow-up from reported New Sales and related performance tracking and improvement measures for individual Application Engineers in RGC market.
   - Benchmark the ASE performance and support measures for improvement.

Required critical behaviours:

1. Strategic thinking;

2. Business, customer intimacy and growth drive (with focus on growth drive);

3. Leadership skills;

4. Ethical behaviour;

5. Professional management of inter-disciplinary processes.

Required key skills (functional/technical):

1. Deep industry knowledge within the Electronic Package area

2. Technical excellence in one or more of the following fields are required:
   - Wafer level packaging or chip packaging
   - PCB/Printed Electronics
   - Passive devices
   - Advanced electronic system assemblies
   - Nano – materials

3. Excellent oral and written English communication skills. Excellent oral and written Chinese (Mandarin) communication skills.

4. Proficient in using current, standard IT software (MS Office, Lotus Notes)

Required Qualification:

1. Masters in Science (materials science, electronics)

2. Five to ten years’ professional experience with a gas supply company or supplier to the electronic industry and entrusted with duties in the field of EP

3. Experience in the thermodynamics as well as with control and analytical methods are desired.

4. Experience as a project manager responsible for cost management and ability to work independently and proactively are a prerequisite.

5. Readiness for travelling on a regular basis (national and international)

We will revert to you within two weeks on status of your application.
如有兴趣，请提交您的申请及个人简历至 hr.china@linde.com